Industry

Baidu and CATL Cooperate on Autonomous Driving and Digitalization

Feb 28, 2025, 14:09pm2025/02/28 14:09:50 Pandaily

On February 27, Baidu, Inc. (referred to as “Baidu<img decoding="async" class="trade-card__loading" layout="fixed" height="50" width="50" src="https://assets.pandaily.com/uploads/2021/12/loading.png" placeholder />“) and Contemporary Amperex Technology Co., Limited (referred to as “CATL”) announced the strategic cooperation signing ceremony held in Ningde, Fujian.

The two parties will cooperate in the two core areas of autonomous driving and digital intelligence, jointly promoting the popularization and development of autonomous driving travel services, as well as the application and promotion of AI in industry.

Baidu<img decoding="async" class="trade-card__loading" layout="fixed" height="50" width="50" src="https://assets.pandaily.com/uploads/2021/12/loading.png" placeholder /> Group founder, chairman and CEO Robin Li, CATL Chairman and CEO Robin Zeng attended and witnessed the signing. Baidu<img decoding="async" class="trade-card__loading" layout="fixed" height="50" width="50" src="https://assets.pandaily.com/uploads/2021/12/loading.png" placeholder /> Vice President Shi Qinghua, CATL domestic passenger car product line vice president Liu Changyan signed on behalf of both parties.

According to the announcement from both sides, they will actively explore cooperation in their respective companies and affiliated resources, including but not limited to CATL’s power batteries, battery exchange products and services, skateboard chassis technology in the development application of unmanned vehicle products, as well as jointly exploring and creating competitive leading unmanned vehicle products and innovative business models.

Baidu<img decoding="async" class="trade-card__loading" layout="fixed" height="50" width="50" src="https://assets.pandaily.com/uploads/2021/12/loading.png" placeholder /> will also support CATL’s digitalization construction with full-stack self-controllable AI capabilities from chips to platforms at the application layer.