BYD Semiconductor to Put 8-Inch Auto Chip Line Into Production Next Month
The Changsha branch of BYD Semiconductor Co., Ltd., a subsidiary of Chinese automobile manufacturer BYD, announced on September 5 that its key project, an 8-inch auto-grade chip production line, had been successfully installed and that production commissioning was underway. It is expected to be officially put into production in early October, with a targeted annual capacity of 500,000 auto-grade chips.
The Changsha-based 8-inch wafer production project started construction in April 2020. It is located in Changsha, Hunan Province, with a planned total investment of 1 billion yuan ($144.5 million).
This project mainly focuses on the R&D and industrial application of electronic core technology of new energy vehicles. By purchasing core production equipment such as high-precision mask aligners and oxidation diffusion furnaces, an advanced 8-inch electronic chip production line of new energy vehicles is being built to realize Chinese-made core components.
BYD Semiconductor’s business mainly includes five sections. It produces power semiconductors including IGBT (Insulated Gate Bipolar Transistor) modules and SiC (Silicon Carbide) modules. The firm also makes intelligent control products of industrial and vehicle-level MCU chips, and intelligent sensors including CMOS (complementary metal-oxide semiconductor) image sensors, fingerprint sensors and electromagnetic sensors. Its products also include optoelectronic semiconductor chips such as LED products and precision optoelectronic devices. Besides, the company provides manufacturing and services related to power devices and integrated circuits.
SEE ALSO: Shenzhen Stock Exchange Resumes BYD Semiconductor’s Listing Review
On September 8, BYD Semiconductor announced its launch of an industrial-grade global shutter CMOS image sensor, BF3031.
BF3031 is a 1/3-inch 500,000 pixel image sensor chip developed with BYD Semiconductor’s global shutter technology. It supports parallel and MIPI digital output interface, and can ensure excellent imaging quality with high sensitivity and advantageous signal-to-noise ratio in low illumination environments. This chip has already been put into the market.
BYD Semiconductor is currently in the process of going public and has submitted related documents to the China Securities Regulatory Commission for registration. However, its listing application has gone through many twists and turns.
