The digital blogger ‘@Digital Chat Station‘ posted on Weibo on Friday that Honor, the leading smart device provider based in China, is debugging the Dimensity 9000 Chip, while products that rely on its chipset will be released later. Honor’s devices will be the first to adopt the Snapdragon 8 Gen1 as its flagship chip. The company is expected to release the first folding screen smartphone based on the Snapdragon 8 Gen1 Mobile Platform in January next year.
The release date given by this blogger also coincides with the release date previously revealed by another account ‘@Changan Shumajun’. The second blogger also said that Honor’s first folding screen smartphone will apply the folding panels provided by BOE and Visionox, which suggests the phone screen will fold inward.
In July this year, it was exposed that Honor had applied for apatent for its folding screen, involving the frame, hinge and connecting electrical wire of the folding screen. Recently, Honor also applied for the names of two new models in Europe, namely “Magic Fold” and “Magic Wing”.
During the 2021 Snapdragon Technology Summit, Qualcomm launched a new generation of Snapdragon 8 Mobile Platform chips. Fang Fei, President of the product line of Honor Device Co., Ltd., said at the summit that Honor’s upcoming next generation flagship smartphone will also be equipped with the new generation Snapdragon 8 Mobile Platform in the first batch.
Among them, the Snapdragon 8 Gen1 is equipped with a Cortex-X2 super-big core with a main frequency of 3.0 GHz, three Cortex-A710 big cores with main frequencies of 2.5 GHz and four Cortex-A510 small cores with main frequencies of 1.8 GHz.