MediaTek officially released its Dimensity 9000 chipset on Thursday, while the terminal using the new chipset is expected to be launched in the first quarter of 2022.
Li Yanji, Deputy General Manager of MediaTek’s Wireless Communication Division, said: “The Dimensity 9000 is specially built for the world’s flagship 5G smartphone, which is a symbol of Dimensity entering a new generation.” The Dimensity 9000 will be the world’s first mobile chip with TSMC’s 4nm node, which features low power consumption and high performance.
The Dimensity 9000 uses the new Armv9 architecture CPUs to deliver unparalleled performance. The octa-core CPU has one ultra Cortex-X2 core operating at up to 3.05GHz, three performance A710 cores operating at up to 2.85GHz and four efficiency Cortex-A510 cores.
The Dimensity 9000 hosts the world’s first Arm Mali-G710 MC10 GPU in a smartphone chip. To further boost performance, the chipset integrates MediaTek’s HyperEngine 5.0, the fifth generation of MediaTek’s innovative gaming technology.
With the integrated LPDDR5X supporting up to 7500Mbps, the Dimensity 9000 is built for the mobile market’s massive bandwidth demands. The chipset integrates MediaTek’s fifth generation Application Processor Unit, which offers 4X power efficiency gains compared to the previous generation APU.
A flagship 18-bit HDR-ISP design gives users the first opportunity to capture HDR video on three cameras simultaneously, while also assuring better power management.
OPPO’s next generation Find X flagship series and Xiaomi‘s Redmi K50 will be equipped with the Dimensity 9000. Vivo and Honor also attended the conference, saying that new products will be equipped with the Dimensity 9000 in the future.
At the end of today’s conference, MediaTek officially announced that the Dimensity 8000 series will also be launched soon.