Showing 12 of 15 posts with this tag
Horizon Robotics’ launch of its fourth-generation BPU architecture “Riemann,” delivering major leaps in performance and efficiency for autonomous driving and next-generation robotics.
On the evening of Sept. 26, Bitmain has officially submitted its listing documents to the Hong Kong Stock Exchange, with China International Capital Corporation...
The second annual Baidu AI Developers Conference, officially known as Baidu Create 2018, opened in Beijing today. Baidu unveiled China’s first cloud-to-edge AI ...
Samsung Electronics has teamed up with Baidu to produce its new cloud-to-edge artificial intelligence (AI) chip, Kunlun, with mass production slated for early next year.
AI chip company Cambricon released their performance report for the first half of this year. During the period, the company’s revenue reached 87.2 million yuan, a year-on-year decrease of 11.01%.
On Wednesday, at the Tencent Digital Ecosystem Summit, Tencent released that it has made a long-term plan in regard to chip R&D and investment for businesses.
On August 15th, Hon Hai Group has invested in AI startup Kneron and announced the release of a new edge computing AI chip called "KL730".
Chinese Artificial Intelligence (AI) chipmaker Horizon Robotics announced a massive $600 million funding in its Series B financing round, setting a new record of funding in the AI chip making industry.
Alibaba unveiled its first AI inference chip on September 25 at Alibaba Cloud’s annual flagship Apsara Computing Conference.
Vastai Technologies, a Chinese high-end chip design company, released a series of new products on September 3 at the 2022 World Artificial Intelligence Conference (WAIC), and unveiled the SG100, a 7nm cloud GPU chip.
At the 2019 Huawei Connect conference, the Chinese telecom giant announced the launch of what it claims is the fastest cluster for training artificial intelligence in the world.
QCraft said on Wednesday that the company will adopt U.S. computer graphics giant Nvidia’s Drive Orin automotive system-on-a-chip to power its third-generation Level 4 self-driving hardware solution.