AI Chip Firm Tsing Micro Bags Several Hundred Million Yuan in B-Round Financing
Beijing-based AI computer chip company Tsing Micro announced on Friday that it has completed a B round of financing worth several hundred million yuan. The investment was led by a fund managed by ProCapital, followed by SenseTime Investment, Prime Pacific Capital, Beijing Integrated Circuit Cutting-Edge Chip Fund and existing shareholders SL Capital and ZY Capital.
Xu Chenhao, Executive Partner of ProCapital, said: “Coarse-Grained Reconfigurable Architecture (CGRA), as a new computing architecture, is one of the key fields that ProCapital pays attention to. Its data-driven spatial domain computing and dynamic programmable characteristics have subversive application potential in the scene of high performance computing, high concurrency and multitasking represented by artificial intelligence. We will help Tsing Micro complete a more comprehensive industrial layout and become a leading international AI chip enterprise.”
This round of financing is mainly to be implemented for the continuous R&D of CGRA technology, and the improvement of product lines and solutions in various fields. The company also plans to improve its delivery capacity and cooperate with more enterprise customers.
Tsing Micro was founded in July 2018. The company is committed to building energy-efficient chips covering the End-Edge-Cloud network through CGRA technology. It has launched TX2 series products for wearable devices and TX5 series products for edge computing. These products have been widely applied in smart security, payment, smart wearable devices and aerospace products, covering several hundred of manufacturers or solutions providers.
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This year, the company is developing TX8 series chips for cloud services, which are used for parallel computing in data centers to solve the energy efficiency problems caused by the continuous expansion of data centers.
In terms of production, Tsing Micro has cooperated with TSMC for an advanced annual production capacity, which can meet customer product needs despite the ongoing global chip shortage.
