
China VC Weekly: Flying Cars and More
This week’s China VC news: the flying car subsidiary of EV-maker Xpeng Motors, HT Aero, bagged a whopping $500 million Series A investment, and more.
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This week’s China VC news: the flying car subsidiary of EV-maker Xpeng Motors, HT Aero, bagged a whopping $500 million Series A investment, and more.
On Monday, Nvidia announced plans to expand collaborations with Chinese automakers, including BYD, aiming to develop EV and AI-enhanced infotainment technologies.
Chinese silicon chip maker SMIC on Monday announced on the official website of the Shanghai Stock Exchange that they decided to grant 67.5352 million restricted shares to 3,944 employees at a price of 20 yuan per share.
Pride Silicon, an automotive chip developer, completed a pre-A round of financing worth tens of millions of yuan, which was exclusively invested by Xiaomi's industrial investment affiliate.
Pimchip Technology, a PIM (Processing in Memory) chip designer, has completed round-A financing of more than $10 million, led by Primavera Venture Partners and followed by some existing shareholders.
Inbisen, a supplier of analog mixed signal chips, announced on July 8 that it had completed an A+ round of financing worth nearly 100 million yuan ($14.9 million), led by Golden China Fund and Huoyan Capital.
Vastai Technologies, a Chinese high-end chip design company, released a series of new products on September 3 at the 2022 World Artificial Intelligence Conference (WAIC), and unveiled the SG100, a 7nm cloud GPU chip.
AMD China announced on domestic social media platform Weibo on Tuesday that it has reached a chip supply cooperation with NIO, a Chinese electric vehicle company. However, a NIO executive responded twice to deny news of cooperation.
On July 18, Yinglefei Semiconductor (Nanjing) Co., Ltd. changed its business registration information and added several new shareholders, including Hubei Xiaomi Changjiang Industrial Investment Fund Partnership.
Yang Zhenyuan, Vice President at ByteDance, said that the company has no general-purpose chip plan and is not involved in businesses such as the manufacturing of CPUs and GPUs.
Li Auto has recruited a new head for its forward-looking technology R&D business – Xie Yan, the former vice president of Huawei's Consumer BG Software Department and the head of its Terminal OS Department.
Huawei's self-developed OLED driver chip has completed trial production, and it is expected to begin mass production and delivery by the end of this year.