Rotex Completes Round A Financing, to Develop Flexible Bioelectronic Technology Products

Rotex
(Source: Rotex)

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Rotex, a solution provider focusing on the development of flexible bioelectronic technology products, announced that it had completed an A round of financing worth tens of millions of yuan on Thursday. This round of financing was led by Alwin Capital and was followed by Hillhouse Capital, Hainan Mangao and B.H.MED.

The fund raised in this round will be mainly used to develop the company’s focus on innovative products based on flexible bioelectronic technology. The company is also looking to expand its medical and non-medical production capacities and to start the product registration clinical research for products currently under research in many medical and aesthetic fields.

Founded in 2015, Rotex has an interdisciplinary team of top scientists from the fields of materials, electronics, mechanics and biomedicine. Its core flexible bioelectronic skin technology can be widely applied in many fields such as transdermal drug delivery, skin physiotherapy, flexible electronics implants, bioelectric signal sensing and mechanical signal flexible sensing.

Flexible electronics technology refers to the designing of electronic devices on flexible plastics, ductile plastics or thin metal substrates, so that the material can maintain photoelectric properties, reliability and integration even when bent, folded, twisted, compressed, stretched or changed into various shapes. At present, the technology is mainly applied in flexible electronics displays, thin film solar panels, radio frequency identification and thin electronic coverings.

In the past six years, Rotex has launched a number of products based on its flexible bioelectronic technology and has successfully built low-cost mass production and market commercialization verification. Its self-developed titanium electronic skin beauty product solution has been well-received in cooperation with many brands.

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Rotex regards the brain-prosthesis interface as the focus of its next stage of product development. The company plans to develop a brain-prosthesis neural interface based on flexible bioelectronics and to build out the technology in order to develop the different sense, including feelings of external temperature and sense of touch. These “feelings” will be converted into electronic signals through the electronic skin sensor system embedded in the intelligent prosthesis and will subsequently be fed back to the brain-prosthesis interface so that the user can sense the external world with the device and flexibly control the prosthesis through the interface.